Purpose
|
To
evaluate the thermal performance of LOPE PC chassis designed by Well
Industrial Design including operating temperature of critical components
and volumetric airflow rate of fans and vent.
|
Theory
and Analysis
|
The
temperature measurement was performed at room temperature and power
dissipation of critical components were simulated by ceramic heaters.
To predict the real operating temperature of critical components
Newton's law of cooling was applied. First law of thermodynamics
was adapted to calculate air temperature.
|
Example
|
Table1.
Case Temperature of CPU
|
Experiment
|
1.3G
|
1.4G
|
1.5G
|
Power
Dissipation(W) |
50.0
|
48.9
|
51.8
|
54.7
|
System
Ambient Temperature(°C) |
25.0
|
35.0
|
35.0
|
35.0
|
CPU
Inlet Temperature(°C) |
30.0
|
40.0
|
40.0
|
40.0
|
Temperature
Rise(°C) |
20.0
|
19.6
|
20.7
|
21.9
|
CPU
Case Temperature(°C) |
50.0
|
59.6
|
60.7
|
61.9
|
|
Equipment
and Instruments
|
NAME
|
MODEL
NUMBER
|
SERIAL
NUMBER
|
RESOLUTION
|
Data
Logger |
FLUKE
NetDAQ 2640A
|
7034411
|
0.0001
|
Thermocouple |
OMEGA
TT-T-36
|
|
0.75%
|
DC
Power Supply |
Chroma
6210-40
|
37750
|
40V/25A
0.1V/0.01A
|
DC
Power Supply |
Topward
6306D
|
994227
|
60V/6A
0.1V/0.01A
|
DC
Load |
Chroma
6314/63102
|
63140254
|
0.01V/0.001A/0.1W
|
Digital
Multimeter |
GW
GDM-8045G
|
2110443
|
0.01V/0.01µA/0.01
|
Micromanometer |
FCO
14
|
9805111,9805112
|
0.1%
|
|